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注意：对于高温操作，用户必须进行类似的测量和计算，以确定特定环境中存在的操作裕度。以下是用户可以采取的一些步骤，以帮助实现升高温度操作：1。将电路板放置在机箱中，使电路板组件侧的气流达到大。2、避免在附近放置高功耗板。仅使用低功耗IP模块。IP模块的位置是位置a（J2和J3）和位置d（J18和J19）。FCC合规性在没有使用符合FCC的底盘的情况下进行了测试，符合A类设备的要求。FCC合规性是在以下条件下实现的：1。所有外部输入/输出端口上的屏蔽电缆。电缆屏蔽通过连接到导电模块前面板的金属外壳连接器连接到接地。3、导电底盘导轨接地。这提供了将屏蔽连接到接地的路径。前面板螺钉正确拧紧。对于低射频发射，必须满足上述条件。否则，可能会影响包含模块的设备的FCC合规性。

Caution For elevated-temperature operation, the user must perform similar measurements and calculations to determine what operating margin exists in a specific environment. The following are some steps that the user can take to help make elevatedtemperature operation possible: 1. Position the board in the chassis for maximum airflow over the component side of the board. 2. Avoid placing boards with high power dissipation adjacent to the . Use low-power IP modules only. The preferred locations for IP modules are position a (J2 and J3) and position d (J18 and J19). FCC Compliance The was tested without IndustryPacks in an FCC-compliant chassis and meets the requirements for Class A equipment. FCC compliance was achieved under the following conditions: 1. Shielded cables on all external I/O ports. 2. Cable shields connected to earth ground via metal shell connectors bonded to a conductive module front panel. 3. Conductive chassis rails connected to earth ground. This provides the path for connecting shields to earth ground. 4. Front panel screws properly tightened. For minimum RF emissions, it is essential that the conditions above be implemented. Failure to do so could compromise the FCC compliance of the equipment containing the module.